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Competencies
Competencies
Product Realization Through In-house Design
Technology Development
System Conceptualization
Module Design and Development
System Integration
Functional and Qualification Testing
Product Certification
Test System Design, Manufacturing & Certification
Design, Implementation and Approval of Production Lines for different types of products
Successful Transfer Of Technology From Design To Production for Mass Manufacturing Of Military Systems
Design Competencies
ELECTRONICS
High Speed Processor Boards
FPGA Boards: Video Decoding and Video Format Conversion, Graphics Generation, Digital Signal Processing, Image Processing
Proximity Electronics for Imagers
Communication protocols: MIL1553B, ARINC429, FC-AE-ASM, Gigabit Ethernet, USB, CANBus
Video Interfaces: STANAG3350, RS343A, DVI, ARINC818
Power Supply design in accordance with MIL STD 704
Analog Electronics for Interfacing, Surge Protection, Isolation, Signal Processing (Filtering, Amplification)
SOFTWARE
Real Time Operating Systems - Integrity and Vx Works
BSP, Device Driver and OGL Driver Development for in-house developed boards
Embedded Application development
DISPLAY
COTS AMLCD Ruggedisation for airborne and ground displays upto 24.0”
NVG compliant displays as per MIL STD 3009
LED based Backlights upto dimming ratio of 3000:1
Touchscreen Capabilities
5 wire Resistive Touch Screens
Multi Point Touch (5/10 point) PCAP Touch Screens
Surface Acoustic Wave (SAW) Touch Screens
OPTICS & COATINGS
On-axis and off-axis optical systems using aspherics and toroidal surfaces
Visual Band Imager
Multilayer, graded beam combiner
MECHANICAL
Thermal analysis including Fanless design capability
Structural analysis capabilities
CG Analysis & Weight Budgeting Analysis
IP 65 and IP 67 capability
SYSTEM
Qualification in accordance with MIL-STD-810, MIL-STD-461, DO 160
Methodologies of Software and Hardware Development : DO178B and DO254
Design and Manufacture of Optical and Electrical Test Systems for qualification, manufacturing and field support
Manufacturing Competencies
Methods Engineering Group for facilitating transfer of product from design to manufacturing
Demonstrated NPI process
Reception of Manufacturing Data File
Development of facilities and requisite skill sets in a time bound manner
Creation of Work instructions and SOPs
FAI and PRR processes establisheds
Employees' training and certification on ongoing basis including IPC levels
Assembly workmanship as per IPC-A-610, Class 2
Lean manufacturing - cycle time reductions, wastage reductions, etc
p-FMEAs
Defect Investigation capabilities
On time deliveries with stringent definitions for OTD
Repair services with fast Turn Around Time (TAT)